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Building the Next Generation of Hyperscale Data Centers

A more connected world is driving exponential growth in data generation and consumption. Acting as the heart of this connectivity is an evolving network of hyperscale data centers. These expansive sites prioritize density, scalability and modularity to serve bandwidth-intensive applications stemming from the internet of things (IoT), streaming, artificial intelligence (AI), machine learning, 1.6T networking and other high-speed applications.

Molex is an innovator in hyperscale data center solutions, leading developments in next generation PCIe technology and introducing a first-to-market comprehensive portfolio of 224 Gbps-PAM4 products and custom architecture designs.

Overview


By 2025, it’s predicted there will be over 1,000 hyperscale data centers, up 100% in only a 5-year period. With more than 300 hyperscale data centers in development today, system architects are rapidly scaling up existing resources and building new infrastructure to meet the growing needs of bandwidth-intensive, high-speed applications. 

Today’s hyperscale data centers are designed for scalability and flexibility, with a typical footprint of 10,000 square feet or more. But current and future trends are testing what it means to hyperscale. 5G technology continues to drive an unquenchable thirst for on-demand digital experiences. AI is spearheading a new revolution, evolving human-to-machine communication via data-intensive multi-model systems connecting text to sound, images, video and sensor data. And businesses around the world are incorporating real-time data to drive factory automation, quantum computing and edge co-locations services. 

Through multi-disciplinary engineering expertise and co-development with our customers, Molex is working hand-in-hand with system architects to meet these demands and build a new era of hyperscale. 

By the Numbers

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1,000+

Hyperscale Sites by 2025

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5,000+

Servers in a Typical Hyperscale Data Center

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224 Gbps

Next-Gen Speeds for Hyperscale

 

 

Fostering Industry Collaboration: The Open Compute Project

As part of our commitment to customer collaboration and next generation data center technology, Molex is an active participant in the Open Compute Project (OCP). The OCP community brings together hyperscalers, telecom providers, enterprise IT users and suppliers to create open solutions for server and storage technologies, spur innovation and drive more efficient, economical and sustainable data centers.

Molex’s NearStack PCIe Connector System and Cable Assemblies were developed in collaboration with the Open Compute Project, and improve signal integrity, lower insertion loss and reduce signal latency.

server compute
Keegan McGraw
“The impact of OCP on our industry is felt in every corner – from storage to networking, CXL to SONiC, and copper to optics. Molex is committed to supporting OCP applications and form factors just as we are to supporting our cloud and enterprise customers. With disaggregated architectures like DC-MHS becoming standard across the industry, participation in OCP is crucial, and we look forward to furthering collaboration with the community.”
Keegan McGraw
Technologist, Data Center Sales
Molex

Copper Interconnects in the Age of 224G

To support the exponential growth of data and processing power in hyperscale infrastructure, high-speed copper interconnects still play a critical role. Learn in our webinar how they are offering unparalleled speed, cost-efficiency, and reliability.

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The Data Center Redefined

Explore the frontier of data center innovation with Molex and the Open Compute Project (OCP). Discover the latest developments in the global engineering endeavor for modularity and scalability that is transforming the way hyperscale data centers are built.

Building Blocks of High-Performance Computing

Data centers are continually striving to upgrade computing performance while maximizing investment in their current infrastructure. Modular architecture solutions for high-performance computing (HPC) provide a strategy for ensuring scalability, thermal management and reliable, high-speed connectivity in next-generation infrastructure. 

224 Gbps-PAM4 High-Speed Data Center Technology

What’s next for hyperscale? The answer is clear: 224 Gbps-PAM4 architecture. But in order for us to release the industry’s first comprehensive portfolio of 224G products, we needed to stretch the limits of physics. This complete suite of products and custom architecture designs is a culmination of decades of engineering expertise and co-development with our customers. The next generation of hyperscale data centers can now be built for the demands of AI, machine learning and future technologies. 

Scaling Up Next-Gen Data Centers

As data centers scale-up system fabrics, innovative solutions are required to support 224G speeds. Learn how Inception, CX2-DS and Mirror Mezz Enhanced provide the flexibility and scalability needed for the next generation of hyperscale data centers.  


Internal High-Speed Connector Systems

high speed io

Backplane Connectors

QSFP-DD Connector System

Mirror Mezz Connectors

NearStack PCIe Connector System

Active Electrical Cables (AEC)

BiPass I/O Connector System

OSFP Connector System

PowerPlane Busbar Connectors

Additional Resources


Report

Thermal Management for Next-Generation Data Centers

Discover next-generation data center thermal management solutions designed specifically for high performance computing. Optimize your server and storage infrastructure with cutting-edge technology, ensuring efficient cooling and maximum performance for your compute-intensive operations.

Application

The Continuing Evolution of PCIe

Emerging high-performance applications from AI to AR are placing unprecedented demands on data center technologies. To keep up, system architects need high-speed, low-latency and highly scalable solutions. Explore how PCIe has evolved over the generations and how Molex has been at the forefront of PCIe Gen 5, 6 and even 7. 

Server Compute PCIe

CAPABILITIES

Data Center Solutions

Integrating 224 Gbps interconnects while managing signal integrity and thermal loads is key to success. Molex industry-leading solutions address these challenges head-on, powering the hyperscale data centers of today and tomorrow. 

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Data Center Thank You

Thank You


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