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Innovation for the Open Compute Project

Emerging cloud technology in data centers is a key factor driving the demand for new systems that offer disaggregated hardware and resilient, portable software. As part of our commitment to customer collaboration and next-generation data center technology, Molex is an active participant in the Open Compute Project (OCP), an industry organization dedicated to compatibility and scalability in high-performance computing (HPC). 

OCP Key Principles


The Open Compute Project (OCP) fosters an ecosystem where global community members including hyperscalers, telecom providers, enterprise IT users and suppliers collaborate to innovate server and storage technologies. This initiative promotes the development and mainstream adoption of the most effective designs for scalable computing environments.

Key principles include the open sharing of ideas, specifications and intellectual property, which OCP asserts as crucial for maximizing innovation and reducing complexity in technology components. This ethos supports the development of commodity hardware that is not only more efficient but also flexible and scalable, challenging the traditional limitations imposed by proprietary, standardized equipment.

Molex actively contributes to the OCP community, focusing on next-generation data center technologies and customer collaboration, driven by the growing demands for disaggregated hardware solutions for the cloud.

OCP Projects


DC-MHS Modular Server Hardware Solutions

Molex is driving innovation in data center technology with the Open Compute Project's DC-MHS initiative, which champions modular and scalable hardware solutions. Learn about our role as a recommended supplier, shaping the future of data centers to meet the dynamic demands of hyperscalers and advanced applications.

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“Molex is a proud member and contributor to the OCP community, working alongside hyperscalers, telecom providers, enterprise IT users and other industry suppliers. We remain committed to providing innovative solutions for standardizing server architecture, enhancing system performance and efficiency, and enabling modularity.”
Keegan McGraw
Technologist, Data Center 
Molex

Advancing Open Compute Power Distribution

As server designs evolve to incorporate high-performance computing and artificial intelligence, the landscape of data center power distribution is undergoing a significant transformation. With escalating power needs driven by the expansion of IoT and edge computing, data centers must adapt with agile, decentralized power management strategies.

OCP Global Summit


AMD Mojanda Reference Design

AMD and Molex present the Mojanda FLW reference design developed by AMD using SP5 sockets that enable PCIe Gen5. Mojanda utilizes Molex NearStack PCIe (SFF TA1026) connectors.

 

 

High-power Interconnects for Single-Phase Immersion Cooling

Molex Principal Engineer Dennis Breen discusses the material compatibility of interconnects in a dielectric liquid. By understanding chemical, electrical, mechanical and environmental factors, material selection and the performance of interconnects can be improved. 
 

Thermal Characterization of High-Power Pluggable Optical Modules

In the leap to 224G data rates, enhanced processing power brings with it inherent thermal impacts, making thermal management both critical and challenging. Molex’s Hasan Ali and Cisco’s Joe Jacques highlight limitations of today’s case temperature approach and discuss alternate methodologies, weighing pros and cons from system and module designers’ points of view.

Enabling Copper for Next Generation Artificial Intelligence Computing

In a groundbreaking partnership between Molex and NVIDIA, this project aims to revolutionize the field of AI by leveraging the potential of copper-based technologies. Molex brings its expertise in developing high-speed board-to-board connectors, which deliver reliable and efficient data transmission within AI systems.
 

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