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Connectors

Automotive Micro Board-to-Board Connections

Joining Automotive with Consumer Experience and Reliable Power Connectivity
With decades of experience in the automotive industry and over 15 years of providing mobile and ruggedized micro-interconnects for consumer devices, Molex leverages its combined knowledge to design and develop advanced FPC-to-board and board-to-board connectors to deliver the high-power connectivity needed in ADAS/AD, hybrid vehicle and EV applications.

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Products

ZN Stack High-Speed 0.50mm-Pitch Floating B-t-B Connectors

EVs Performance Will Never Be the Same
As demand for hybrid vehicles and EVs grows exponentially, suppliers need to source reliable high-power micro-interconnects to drive this new level of performance and functionality. They need field-tested and field-proven automotive micro solutions that have been built to leverage world-class design and manufacturing capabilities along with decades of experience in both the automotive and mobile device industries.

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FPC-to-Board Connectors for EV Battery Management

As demand for hybrid and EVs grows, suppliers need interconnects designed to tolerate the harsh environment of electric powertrains. They need field-tested and field-proven automotive micro solutions to provide reliable FPC-to-Board Connectors for battery management systems (BMSs) that meet the size and performance requirements demanded by EV manufacturers.

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Anti-Vibration
Dual-beam contact:
Contributes to improving anti-vibration and anti-dust performance

Anti-Dust/Condensation
Terminal isolation:
Contributes to improving dielectric performance under condensation

Poka-Yoke
• Poka-Yoke (mistake proofing) implementation:
  Is brought about by the shape
• Jacket for FPC:
  Covers FPC terminal and protects mating parts from dust

High-Speed 0.50mm-Pitch Floating Board-to-Board Connector for ADASs

Autonomous Driving Will Never Be the Same
As automakers race to meet the accelerating demand for advanced driver assistance systems (ADASs)/autonomous driving (AD) capabilities, a growing number of electronic control units (ECUs) and next-generation domain control units (DCUs) are being added to vehicles. As a result, suppliers need a source for micro-interconnect solutions that perform reliably, even in the harshest environments.

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A footprint of 215.30mm²:
• Delivers one of the smallest footprints in the market
• Mitigates space constraints on PCBs

Up to 32 Gbps data rate:
• Provides faster data speeds than PCIe 4
• Offers low latency performance

Mating Guide:
Makes mating easier and potentially lowers the risk of mis-mating

Full terminal covers:
Keeps dirt and debris away from terminals to ensure reliable connectivity

Stack height from 16.00 to 32.00mm and from 60 to 200 circuits:
Delivers design flexibility

Wide floating range:
• Offers ±0.60mm float in the x axis, ±0.80mm in the y axis and ±0.80mm in the z axis
• Facilitates automated assembly