Power efficiency is critical to cost and safety management in power- intensive applications, such as power transmission systems in data centers, base stations, battery management, inverters, etc. Sentrality High-Current Pin and Socket Interconnects incorporate Molex’s proven COEUR sockets, which have multiple contact beams to create a large contact surface at the contact interface, resulting in very low contact resistance. The voltage drop across the contact interface is therefore very low, which leads to minimal heat generation.

It is challenging to align sockets and pins when mating parallel PCBs or busbars, due to tolerance stack-up issues inherent in any mechanical design. A degree of self-alignment is valuable to gather the connectors during mating and mitigate any misalignment. Sentrality High-Current Pin and Socket Interconnects, incorporating Molex’s proprietary OmniGlide technology, provide up to 1.00mm of radial self-alignment (industry leading). This minimizes potential damage to the connectors and specifically the socket’s contact beams during mating.

Dense electronic packaging demands low stack heights between mated substrates and the ability to easily customize connector profiles to optimize connector protrusions above the top substrate and below the bottom substrate. Sentrality High-Current Pin and Socket Interconnects are only 10.00mm tall, regardless of pin size. The position of the socket flange (that rests on the PCB) can be easily customized for customer applications to optimize protrusion beyond the top or bottom of the substrates.

My design has unique space constraints that limit the height that the socket assembly can protrude above (or below) the printed circuit board (or busbar). Do I need to fund tooling for a custom socket assembly?
No, customer funding is not required. The socket assembly housing is machined, so Molex can position the flange anywhere along the length of the housing body to meet your requirements. Contact your local Molex sales representative for details.

My design has a unique board-to-board, busbar-to-board or busbar-to-busbar stack height requirement. Do I need to fund tooling for a custom length pin?
No, customer funding is not required. The pin is machined, so Molex can manufacture a pin of whatever length your application requires. Contact your local Molex sales representative for details.

I am interested in purchasing a busbar assembly with Sentrality connectors already attached to it, rather than individual Sentrality pins and sockets. Is Molex able to provide integrated busbar solutions?
Yes. Molex has a business segment that designs and fabricates busbars. This business segment also designs and manufactures fully integrated busbar solutions. Contact your local Molex sales representative for details.

What is the minimum board-to-board stack height that can be achieved using a Sentrality pin and a Sentrality surface-mount or knurled press-fit socket assembly?
The minimum achievable board-to-board stack height is determined by the Sentrality pin you select for your design.
- The minimum stack height when mating a Sentrality knurled press-fit pin and a surface-mount or knurled press-fit socket is 1.50mm.
- The minimum stack height when mating a Sentrality surface-mount pin and a surface-mount or knurled press-fit socket is 1.75mm.
- The minimum stack height when mating a Sentrality screw-mount pin and a surface-mount or knurled press-fit socket is 4.50mm.