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Connectors

High-Speed Pluggable IO

Today’s networking and data center professionals face rapidly escalating bandwidth requirements, demanding high-density interconnects that allow today’s streamlined form factors to support tomorrow’s capabilities. Molex empowers customers with scalable high-speed pluggable input-output (I/O) solutions that help address next-generation thermal and performance needs for future-proof configurations. Our one-stop innovations include precision-engineered cables, connectors and cages that reflect leading-edge protocols and standards, like QSFP-DD and OSFP.

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Industry Standard Pluggable IO

QSFP-DD Connector System

QSFP-DD Interconnect System’s 8-lane electrical interface transmits 28G NRZ, 56G PAM-4 and 112G PAM-4, up to 200, 400 or 800 Gbps aggregate. Backwards compatible with QSFP.
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QSFP Connector System

28G NRZ, 56G PAM-4, 112G PAM-4, up to 100, 200 or 400Gbps aggregate. Offer low insertion loss and cross talk plus excellent electromagnetic interference (EMI) containment.
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OSFP Connector System

Octal Small Form Factor Pluggable (OSFP) 112 Gbps PAM-4 Interconnect System and Cable Assemblies provide single-port, 8-lane I/O connectivity with DAC, AOC, ACC and optical modules for high-density switch applications.
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SFP and SFP+ Connector System

Supporting 2.5 to 10 Gbps data rates for Gigabit Ethernet and Fibre Channel applications, Molex’s SFP+ and SFP products ensure industry-wide compatibility.
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SFP-DD (56G PAM-4) Connector System

SFP-DD Module and Cage/Connector System delivers a 2-lane electrical interface, complementing QSFP-DD top-of-the-rack interfaces, and addresses issues caused by underpopulated lanes in file server interconnects. Transmits 28G NRZ and 56G PAM-4, up to 50 or 100 Gbps aggregate. Backwards compatible with SFP.
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CDFP / zCD Connector System

Offering the highest port and bandwidth density of any pluggable form factor available, the zCD Interconnect System delivers 400 Gbps per port with superior signal integrity performance. 16G NRZ, 32G NRZ, 64G PAM-4 for PCIe Gen 3, Gen 4 and Gen 5 applications.
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External Laser Source Interconnect System (ELSIS)

The External Laser Source Interconnect System (ELSIS) is a first-to-market blind-mating optical and electrical interconnect in a pluggable module format that supports co-packaged optics (CPO) requiring a remote laser source.
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Internal Cables

BiPass I/O Connector System

BiPass I/O High-Speed Solutions with low-insertion-loss copper twinax cables serve as a PCB alternative to enable efficient and reliable implementation of 56 and 112 Gbps PAM-4 protocols.
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External Cables

Active Electrical Cables (AEC)

Responding to higher bandwidth demands, Active Electrical Cable (AEC) Solutions with QSFP-DD and OSFP Interconnects are a new category of pluggable connectivity designed for cost-effective , low-loss operation at 112G PAM-4 speeds and higher (port capacity between 100 and 800 Gbps) while increasing reach up to 5.0m without optical cables.
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Direct Attach Cable (DAC) Assemblies

High-speed I/O passive cable assemblies that can deliver data rates as high as 400 Gbps with a variety of lengths or customized options for greater design flexibility.
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Active Optical Cables (AOC)

Molex Active Optical Cables (AOCs) achieve high data rates over long reaches, using a fraction of the power of other brands while providing streamlined installation for high-performance computing and storage applications
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