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OSFP Connector System

Octal Small Form Factor Pluggable (OSFP) 112 Gbps PAM-4 Interconnect System and Cable Assemblies provide single-port, 8-lane I/O connectivity with DAC, AOC, ACC and optical modules for high-density switch applications.

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Product Highlights

Data Rate:Interface Design:Lanes:
112 Gbps PAM-4
56 Gbps		DAC, AOC, ACC, Optical16 of 112 Gbps PAM- 4; and
4 Rx and 4 Tx pairs on each row

High-Speed I/O Connectors

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High-Speed EMI Cages

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High-Speed I/O Cables Assemblies

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Features and Benefits

Optimized interface

The OSFP connector supports 16 lanes of 112 Gbps PAM-4 and is compatible with previous-generation 56 Gbps mating interfaces. Also, the terminal width and spacing feature tight tolerance control for superior signal integrity performance, and the connector structure and mating interface include grounding.

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Improved thermal performance

Achieving 112 Gbps PAM-4 data rates while also improving thermal performance, OSFP connectors generate less heat and are ideal when thermal issues are a concern and backward compatibility to QSFP-DD isn’t a factor.

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Off-the-shelf cable assemblies with OSFP connectors

Off-the-shelf cable assemblies with OSFP Connectors, MSA compatible for 56 and 112 Gbps applications, are readily available to enable upgrades more quickly and without downtime.

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Cages

112 Gbps PAM-4 and 56 Gbps versions are available:
Has a single-port, high-speed and high-density design intended to interface with DAC, AOC, ACC and optical modules

Meets IEEE 802.3ck channel compliance and OSFP 112G multi-source agreement (MSA):
Complies with industry standards for easy implementation

Single, dual and quad light pipe options available. Two different types of ventilation designs available:
Provides design flexibility

Improved EMI shielding and 2D press-fit design:
Delivers enhanced EMI performance

• Hexagonal ventilation
• Thermally optimized for >12W applications:
• Cooling to support a 25W module in an enterprise environment:
Enhances thermal and EMI performance

Spring fingers:
Offer additional robustness

Easy to insert cage to board while improving retention force:
Delivers convenient assembly without sacrificing reliability

Connectors

Supports 16 lanes of 112 Gbps PAM-4; 4 Rx and 4 Tx pairs on each row:
Provides an optimized interface

Good contact points between ground shield and ground beams; good contact of the flex shield to rigid and ground beams:
Prevents crosstalk

Complete connector structure and mating interface:
Provides grounding protection

Tight tolerance control of terminal width and spacing:
Achieves superior signal integrity performance

Laser welding technology used for terminal insertion:
Ensures terminal position accuracy

Compatible with previous-generation 56 Gbps mating interface:
Facilitates easy to implement without having to change entire infrastructure

Direct Attach Cable (DAC) Assemblies

Ground structure terminates drain and prevents crosstalk:
Improves signal integrity performance

MSA compatible for 56 and 112 Gbps applications:
Delivers reliable high-speed performance

Molded cable strain relief inside backshell:
Prevents wire and PCB damage

Supports up to 2.0m DAC implementation. 25 to 26 AWG available:
Offers design flexibility

Overview

Thermal issues can hinder performance, especially as data rates increase. Compact connectors save space but tend to generate more heat, requiring time and money to be spent on cooling systems. The OSFP interconnect system is a slightly larger connector than its QSFP-DD counterpart. Because bigger connectors help with airflow and colling, OSFP connectors generate less heat, doing their part to mitigate thermal issues.

Data center and telecommunication OEMs often have to delay infrastructure upgrades while waiting for the production of cable assemblies. OSFP cable assemblies are readily available. The OSFP interconnect system supports legacy cables as well as upgraded plugs and is MSA compatible for 56 and 112 Gbps applications.

 

Applications by Industry

High-density switches

This is not a definitive list of applications for this product. It represents some of the more common uses.

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