Skip to main content

CDFP / zCD Connector System

Offering the highest port and bandwidth density of any pluggable form factor available, the zCD Interconnect System delivers 400 Gbps per port with superior signal integrity performance. 16G NRZ, 32G NRZ, 64G PAM-4 for PCIe Gen 3, Gen 4 and Gen 5 applications.

Find Parts Contact Us

Product Highlights

Data Rate:Pairs:Channels:
400 Gbps32 (16 channels) per I/O port at 25 Gbps16 bi-directional channels operating at up to 28 Gbps

High-Speed I/O Connectors

Find Parts

High-Speed I/O Cables Assemblies

Find Parts

Features and Benefits

Data rates scalable up to 400 Gbps (25 Gbps over 16 lanes):
Supports high-bandwidth (fat pipe) next-generation applications. Enables 4.4 Tbps with 11 modules on a line card. Supports next-generation 400 GbE.

0.75mm pitch, 16 lanes of 25 Gbps per port:
Provides compact footprint. Delivers high-density connection.

Elastomeric gasket:
Provides superior EMI containment and suppression.

Unique footprint optimizes signal integrity performance while also supporting straight-back routing:
Simplifies routing task. Optimizes board edge density – no need to side route to access inner PTH rows.

EEPROM (electrically erasable programmable read-only memory) compatible:
Allows customer to enter customized information.

Densest, fastest I/O connector in the market:
Enables network and data center OEMs to meet ever-increasing bandwidth needs.

Designed to accept a broad range of customer-specified thermal modules:
Provides excellent thermal management.

Three different diecast cage styles with mechanical keying available:
Meets varying design needs. Mechanical keying prevents mismating

Cable assemblies available with 30 AWG discrete twinax cable:
Allows for cable flexibility. Reduces cable bundle size.

Overview

The rapid growth of connected devices and increasing bandwidth use require significant increases in the capacity of telecommunication networks and data center equipment connections. The zCD Interconnect System, Style 1 delivers cutting-edge technology, transmitting 400 Gbps data rates (25 Gbps per serial lane) with excellent signal integrity (SI), electromagnetic interference (EMI) protection and thermal cooling.

The data center/networking industry is driving to smaller, faster and lower-cost infrastructure. zCD enables the highest port and bandwidth density of any pluggable form factor currently on the market. For example, with a 0.75mm pitch and 400 Gbps per port, a 1U switch can deliver more than 5 Tbps.

SFP+ and QSFP+ form factors are popular with data center and networking OEMs due to their ability to more than double front panel density. But future data rate needs will make these connectors obsolete. The zCD Interconnect System, conforming to the CDFP MSA, was conceived around the same form factors as SFP+ and QSFP+. But the zCD form factor will more than double the front panel density of QSFP+ while offering 400 Gbps data rates.

 

Applications by Industry

Enterprise computing
Top-of-rack switches

Core switches
Routers

This is not a definitive list of applications for this product. It represents some of the more common uses.

Resources