Fine-pitch battery connectors that provide up to 10.0A, a hybrid interface, wide alignment guides for easier mating and a robust metal armor cover that acts as housing protection for secure electrical and mechanical contact.

World’s smallest board-to-board connector ideally suited for space-constrained smartphones, smartwatches, wearables, AR/VR devices and more!

5G mmWave RF Flex-to-Board Connectors offer excellent signal integrity (SI) performance for high-speed, extreme RF applications, along with the robust mating features and PCB real-estate space savings needed in compact 5G mobile and other communication devices.

KK connector systems are customizable for a variety of power and signal applications. Available in industry-standard 2.54, 3.96 and 5.08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile.

Offers premium housing features to prevent mis-mating, reduce terminal backout, reduce operator fatigue during assembly and aid in blind-mating applications.

The Micro-Fit+ Connector System is a Glow Wire Capable wire-to-board and wire-to-wire system which offers a 3.00mm pitch, a higher-current rating of up to 13.0A and superior design options for flexibility and efficient assembly.

The Mini-Fit Connector family delivers an operating temperature up to +125° C, offers a double crimp tool and is available in board-to-board, wire-to-board and wire-to-wire configurations.

EXTreme Power products offer high-current interconnect solutions with best in class power densities. The extensive product offering ranges from EXTreme LPH 30.0A blades to EXTreme PowerMass 150.0A modules. Molex EXTreme Power products – made for your high-current applications.

Molex’s Sentrality Pin and Socket Interconnect System offers high-current board-to-board, busbar-to-board and busbar-to-busbar connectors and provides a +/- 1.00mm radial self-alignment to overcome tolerance stack-up issues.

Designed for high-density, high-performance mezzanine applications, the HD Mezz Mezzanine Connector System simplifies PCB routing and maximizes card-slot space while delivering 12.5 Gbps data rate.

A qualified PMC IEEE 1386 standard connector that provides a rugged housing and protected pin interface for reliable signal transmission, a slim-body housing that minimizes airflow obstruction and the versatility to be arrayed to increase circuit size.

Footprint-compatible hermaphroditic Mirror Mezz and Mirror Mezz Pro Mezzanine Connectors lower application costs eliminating the need for separate mating parts and offer maximum design flexibility by allowing the user to pair different connector height versions to achieve the desired stack height while supporting data speeds up to 112 Gbps per differential pair for telecommunications, networking and other applications.

Modular NeoPress High-Speed Mezzanine System enables design flexibility on space-constrained PCBs with tunable differential pairs, low stack heights and compliant-pin terminations while offering data rates up to 28 Gbps.

Delivering the connector with the fastest data rate in the market today at 56 Gbps and the cleanest signal integrity, Molex’s modular NeoScale Mezzanine System features a high-speed triad wafer design for customized PCB routing in high-density system applications.

Low-profile SEARAY Mezzanine Connectors and Jumpers deliver a 12.5+ Gbps data rate, small footprint and robust solder-charge termination while SEARAY Slim Connectors also improve airflow to address thermal management issues.

The SpeedMezz Connector family offers high-densities, low profiles, data rates up to 56 Gbps per differential pair and easy upgrading with common receptacle footprints to deliver versatile solutions for high-speed mezzanine, rugged edge card and lower speed applications.