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Board-to-Board Connectors

Mirror Mezz Connectors

Mirror Mezz Connectors and Open Compute Project (OCP)-standard Mirror Mezz Pro and Mirror Mezz Enhanced Connectors are stackable, hermaphroditic mezzanine connectors that deliver superior signal integrity performance and data speeds up to 224 Gbps to address ever-increasing data transmission requirements for telecommunications, networking and other high-density applications.

Data Rate Pitch Stack Height Pin Count
up to 224 Gbps 4.00 by 1.50mm differential pair pitch 5.00, 8.00 and 11.00mm Up to 270 differential pairs

Mirror Mezz

Mirror Mezz Pro

Mirror Mezz Enhanced

Features and Benefits


Printed circuit board (PCB) space is becoming increasingly critical as customers seek to pack more functionality into the same area to meet various application requirements. The Mirror Mezz Connector offers up to 270 differential pairs (DPs) and 107 to 115 DPs per square inch. This leads to huge space and cost savings, considering that the connector offers much higher density than the industry average. 

With chips becoming more advanced and data rates increasing, the need for high-speed connectors in data centers and other markets becomes increasingly critical. Molex Mirror Mezz Enhanced Connectors are the first board-to-board connectors of their type to deliver data speeds up to 224 Gbps NRZ.

High-density server applications need fewer parts in order to reduce costs and increase operational efficiency. The hermaphroditic Mirror Mezz Connector is designed to cut tooling, inventory and operational costs while increasing time and process efficiencies for the customer.

Other design features that maximize cost savings for customers:
    - BGA-attach termination (with short leads) solves the problem of producing a miniature package with hundreds of pins
    - Footprint compatibility with existing Mirror Mezz products eliminates the need for PCB redesign during system upgrades.

224 Gbps Data Rates

With the emergence of artificial intelligence (AI) and a rapid increase in data transmission speeds, telecommunications and networking requirements are growing. Mirror Mezz Connectors offer up to 224 Gbps data rates for next-generation performance.

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Density and Compactness

Mirror Mezz Connectors offer a dense pin field with up to 270 differential pairs in a compact, low-profile hermaphroditic design that offers cost savings by reducing real estate requirements and simplifying both inventory complexity and installation processes.

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Approved as an Open Compute Project (OCP) Standard

The OCP was founded to create commodity hardware that supports companies as they transition their infrastructure to meet today’s connectivity demands. Thanks to its high data rates, high density and innovative hermaphroditic design, the Mirror Mezz 15x11 connector is an OCP standard board-to-board solution for accelerator cards.

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Reduces assembly errors and damage during mating with robust shrouded housing design
Shrouding helps protect contact tips from stubbing or other damage and pass the “thumb test”

Blind mating simplifies assembly operations
Contact tip design offers fine alignment of 0.70mm in blind mating scenarios, making mating operations easier and more reliable

Improves signal integrity (SI) performance and reliability
“Stubless” contact interface includes two points of contact on each beam for greater reliability and reduces minimum stack height to 5.00mm

Offers increased reliability
Opposing beam support ensures full support for mated beams at mated condition with 1.50mm maximum wipe

Supports data transmission rates up to 224 Gbps using compatible mating interface
Enables upgrading to next-generation speeds without PCB redesign

Lowers costs through hermaphroditic design
Simplifies procurement processes and inventory management while minimizing tooling requirements

Optimizes use of space in height-constrained applications
Cross-mating or self-mating of 2.50 and 5.50mm height connectors permits ultra-low and medium stack heights of 5.00, 8.00 or 11.00mm

Eases design challenges by maximizing PCB real estate
High-density connector pin field includes up to 270 differential pairs (DPs) and 107 to 115 DPs per square inch

Permits easy upgrades to 224 Gbps speeds with Mirror Mezz Enhance
Identical footprint to Mirror Mezz and Mirror Mezz Pro connectors helps reduce PCB redesign requirements

Reduces costs through use of ball grid array (BGA) attachment
Proven BGA design features a consistent ball profile, leading to improved and more predictable SI

Provides cost savings and design versatility
Flex cable links offer excellent SI with controlled channels and pinned grounds, enabling relaxed tolerancing with offsets between boards and flexible architecture

Optimizes performance and SI
Pitch varies between contacts and “paddles” to optimize impedance while paddle-to-contact bend direction alternates between rows to minimize crosstalk

Datasheets and Guides


Videos and Webinars


High-Speed Board-to-Board

Learn more about Mirror Mezz design features generating space and cost savings, offering much higher density than the industry average.

The Enduring Edge of Copper: Copper Interconnects in the Age of 224G

Discover the latest innovations in high-speed board-to-board connectivity, exploring the evolution of the Mirror Mezz product family and its ability to support data speeds up to 224Gbps. Learn why copper interconnects remain essential in today's tech landscape, offering unmatched speed, efficiency, and compliance for high-bandwidth applications.

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Applications by Industry


Networking
Servers
Storage

Infrastructure
Networking

This is not a definitive list of applications for this product. It represents some of the more common uses.

Frequently Asked Questions


What are the differences between Mirror Mezz Enhanced and other Mirror Mezz solutions?
Mirror Mezz Enhanced supports faster signal speeds of up to 224 Gbps and has improved signal integrity performance when compared with Mirror Mezz and Mirror Mezz Pro.

Which Mirror Mezz solution is right for my application?
Mirror Mezz, Mirror Mezz Pro and Mirror Mezz Enhanced mezzanine connectors offer excellent data speeds and signal integrity to meet next-generation data center requirements. Molex offers a wide variety of circuit counts for different applications. Please contact us for details.

How many stack height options does Mirror Mezz Enhanced offer?
Similar to Mirror Mezz and Mirror Mezz Pro, Mirror Mezz Enhanced comes with three different stack heights of 5.00mm, 8.00mm and 11.00mm through the combination of 2.50mm and 5.50mm high connectors.